Texas Instruments - CLC109ALC

  1. Home
  2. Texas Instruments - CLC109ALC
CLC109ALC by Texas Instruments

Image shown is a representation only.

Manufacturer Texas Instruments
Manufacturer's Part Number CLC109ALC
Description BUFFER; Temperature Grade: MILITARY; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;
Datasheet CLC109ALC Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Nominal Bandwidth (3dB): 270 MHz
Maximum Supply Voltage Limit: 7 V
Surface Mount: YES
Maximum Supply Current: 4 mA
No. of Terminals: 4
Minimum Slew Rate: 250 V/us
Maximum Input Offset Voltage: 5000 uV
Terminal Position: UPPER
Package Style (Meter): UNCASED CHIP
Technology: BIPOLAR
JESD-30 Code: X-XUUC-N4
Package Shape: UNSPECIFIED
Terminal Form: NO LEAD
Maximum Operating Temperature: 125 Cel
Package Code: DIE
Amplifier Type: BUFFER
Nominal Slow Rate: 350 V/us
Nominal Negative Supply Voltage (Vsup): -5 V
Minimum Output Current: .04 A
Minimum Operating Temperature: -55 Cel
Maximum Average Bias Current (IIB): 4 uA
No. of Functions: 1
Qualification: Not Qualified
Nominal Supply Voltage / Vsup (V): 5
Maximum Negative Supply Voltage Limit: -7 V
Temperature Grade: MILITARY
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

MAX4201EUK+ by Maxim Integrated

MAX4201EUK+

Maxim Integrated

BUFFER; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH;
MAX405C/D by Maxim Integrated

MAX405C/D

Maxim Integrated

BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR;
MAX4277CPA by Maxim Integrated

MAX4277CPA

Maxim Integrated

BUFFER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BUF634FKTTT by Texas Instruments

BUF634FKTTT

Texas Instruments

BUF634FKTTT by Texas Instruments is a buffer amplifier with a max input offset voltage of 100000 uV and a max average bias current of 20 uA. It is commonly used in automotive applications due to its temperature grade and small outline package style.
BUF11704AIPWPRG4 by Texas Instruments

BUF11704AIPWPRG4

Texas Instruments

BUFFER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: HTSSOP; Package Shape: RECTANGULAR;
MAX4215EUA+ by Analog Devices

MAX4215EUA+

Analog Devices

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
BUF03BJ/883 by Analog Devices

BUF03BJ/883

Analog Devices

BUFFER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Supply Voltage / Vsup (V): 15;
AD9630SZ/883B by Analog Devices

AD9630SZ/883B

Analog Devices

BUFFER; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE;
ADLH0033CG by Analog Devices

ADLH0033CG

Analog Devices

BUFFER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Code: QIP; Package Shape: SQUARE;
AD8570ACP by Analog Devices

AD8570ACP

Analog Devices

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: VQCCN; Package Shape: SQUARE;
MAX4288EUB+ by Maxim Integrated

MAX4288EUB+

Maxim Integrated

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
THS7318YZFT by Texas Instruments

THS7318YZFT

Texas Instruments

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 9; Package Code: VFBGA; Package Shape: SQUARE;
MAX4209HAUA+ by Maxim Integrated

MAX4209HAUA+

Maxim Integrated

BUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR;
MAX405EPA by Maxim Integrated

MAX405EPA

Maxim Integrated

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
MAX4285EUT-T by Maxim Integrated

MAX4285EUT-T

Maxim Integrated

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;
MAX4022EEE+T by Analog Devices

MAX4022EEE+T

Analog Devices

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
EL5129IRE by Renesas Electronics

EL5129IRE

Renesas Electronics

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: HTSSOP; Package Shape: RECTANGULAR;
MAX2470EUT+ by Analog Devices

MAX2470EUT+

Analog Devices

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;
BUF05703PW by Texas Instruments

BUF05703PW

Texas Instruments

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
MAX4022EEE+ by Maxim Integrated

MAX4022EEE+

Maxim Integrated

BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;