Texas Instruments - CC3200MODR1M2AMOBR

CC3200MODR1M2AMOBR by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number CC3200MODR1M2AMOBR
Description MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BUTT; No. of Terminals: 63; Package Code: BCC; Package Shape: RECTANGULAR;
Datasheet CC3200MODR1M2AMOBR Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 2.3 V
Package Body Material: UNSPECIFIED
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.45 mm
Surface Mount: YES
Terminal Finish: NICKEL GOLD
ADC Channels: YES
No. of Terminals: 63
DMA Channels: NO
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER
No. of I/O Lines: 25
Technology: CMOS
JESD-30 Code: R-XBCC-B63
Package Shape: RECTANGULAR
Terminal Form: BUTT
Maximum Operating Temperature: 70 Cel
Package Code: BCC
Width: 17.5 mm
Moisture Sensitivity Level (MSL): 3
Data EEPROM Size: 0
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 3.6 V
External Data Bus Width: 0
DAC Channels: NO
JESD-609 Code: e4
Minimum Operating Temperature: -20 Cel
Length: 20.5 mm
PWM Channels: NO
Peak Reflow Temperature (C): 260
Analog To Digital Convertors: 4-Ch 12-Bit
Bus Compatibility: I2C; SPI; UART
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
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