Telcom Semiconductor - 4860

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4860 by Telcom Semiconductor

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Manufacturer Telcom Semiconductor
Manufacturer's Part Number 4860
Description SAMPLE AND HOLD CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet 4860 Datasheet
NAME DESCRIPTION
Package Body Material: CERAMIC
Sub-Category: Sample and Hold Circuits
Surface Mount: NO
Terminal Finish: Tin/Lead (Sn/Pb)
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
No. of Functions: 1
No. of Terminals: 24
Qualification: Not Qualified
Package Equivalence Code: DIP24,.6
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: HYBRID
JESD-30 Code: R-XDIP-T24
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Amplifier Type: SAMPLE AND HOLD CIRCUIT
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 5,+-15
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