Image shown is a representation only.
| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | M29F002BNB55N1 |
| Description | FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TSOP1; Package Shape: RECTANGULAR; Memory Density: 2097152 bit; |
| Datasheet | M29F002BNB55N1 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .0001 Amp |
| Organization: | 256KX8 |
| Maximum Seated Height: | 1.2 mm |
| Programming Voltage (V): | 5 |
| Minimum Supply Voltage (Vsup): | 4.5 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 20 mA |
| Command User Interface: | YES |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 32 |
| No. of Words: | 262144 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G32 |
| No. of Sectors/Size: | 1,2,1,3 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Endurance: | 100000 Write/Erase Cycles |
| Package Code: | TSOP1 |
| Width: | 8 mm |
| Boot Block: | BOTTOM |
| Memory Density: | 2097152 bit |
| Sector Size (Words): | 16K,8K,32K,64K |
| Toggle Bit: | YES |
| Memory IC Type: | FLASH |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP32,.8,20 |
| Length: | 18.4 mm |
| Maximum Access Time: | 55 ns |
| No. of Words Code: | 256K |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Additional Features: | BOTTOM BOOT BLOCK |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 5.5 V |
| Data Polling: | YES |
| Power Supplies (V): | 5 |
