Spansion - S71WS256PC0HH3YR0

S71WS256PC0HH3YR0 by Spansion

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Manufacturer Spansion
Manufacturer's Part Number S71WS256PC0HH3YR0
Description FLASH; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA84,10X12,32;
Datasheet S71WS256PC0HH3YR0 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16MX16
Maximum Seated Height: 1.2 mm
Programming Voltage (V): 1.8
Minimum Supply Voltage (Vsup): 1.7 V
Sub-Category: Other Memory ICs
Surface Mount: YES
No. of Terminals: 84
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B84
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 8 mm
Memory Density: 268435456 bit
Mixed Memory Type: FLASH+PSRAM
Memory IC Type: FLASH
Minimum Operating Temperature: -25 Cel
Memory Width: 16
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA84,10X12,32
Length: 11.6 mm
Maximum Access Time: 80 ns
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 1.8
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 1.95 V
Power Supplies (V): 1.8
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