Simcom Wireless Solutions - SIM7600G

The NXP Semiconductors MFRC53101T/0FE,112 is a telecom interface IC with 32 terminals in a small outline package. It operates b/w -25°C to 85°C, with a nominal voltage of 3.3V. Ideal for telecom circuits, it has a peak reflow temperature of 250°C and terminal pitch of 1.27mm.

RF AND BASEBAND CIRCUIT;

TELECOM CIRCUIT;

Microchip Technology's RN4020-V/RM120 is a telecom IC with 24 terminals, operating at 3.3V. It offers a data rate of 1 Mbps and operates b/w -30 to 85°C. Ideal for applications requiring high-speed communication in compact spaces.

FUSB340TMX by Onsemi is a Telecom Interface IC with 18 terminals in a rectangular chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3.6V, it is designed for telecom circuit applications.

AD9874ABSTRL by Analog Devices is a BICMOS TELECOM CIRCUIT with 48 terminals, operating at -40 to 85 °C. It has a PLASTIC/EPOXY body, suitable for telecom interfaces. The IC supports power supplies of 3/3.3V and 3/5V, with a compact FLATPACK package style.

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 167; Package Code: LFBGA; Package Shape: SQUARE;

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

RN4678APL-V/RM120 by Microchip Technology is a telecom IC with 33 terminals, operating b/w -20 to 70°C. It has a supply voltage of 1.9V and terminal pitch of 1.1mm. This surface-mount rectangular package is ideal for telecom circuit applications due to its compact size and commercial temperature grade suitability.

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;

TELECOM CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: NO; Package Style (Meter): SPECIAL SHAPE;

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 33; Package Code: XMA; Package Shape: RECTANGULAR;

BM70BLES1FC2-0B05BA by Microchip Technology is a telecom interface IC with surface mount capability. It operates in an industrial temperature range of -40 to 85 °C and has a data rate of 0.0086 Mbps. This IC is commonly used in telecom circuits for various applications.

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

CYBLE-416045-02 by Infineon Technologies is a telecom IC with 43 terminals, operating at -40 to 85°C. It has a data rate of 8000 Mbps and operates at a nominal voltage of 3V. This surface-mount IC is ideal for industrial applications requiring high-speed telecommunications interfaces.

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

NEO-M8Q-0 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. With AEC-Q100 screening and TS 16949 certification, it's ideal for industrial applications requiring a 3V supply voltage. Its compact rectangular package measures 12.2mm x 16mm with a seated height of 2.6mm, making it suitable for space-constrained designs in automotive or telecommunications systems.

RF AND BASEBAND CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN;