Samsung - K3N3C1000D-TE12

K3N3C1000D-TE12 by Samsung

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Manufacturer Samsung
Manufacturer's Part Number K3N3C1000D-TE12
Description MASK ROM; Temperature Grade: OTHER; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Organization: 256KX16;
Datasheet K3N3C1000D-TE12 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00005 Amp
Organization: 256KX16
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 4.5 V
Sub-Category: MASK ROMs
Surface Mount: YES
Maximum Supply Current: 50 mA
Terminal Finish: TIN LEAD
No. of Terminals: 44
No. of Words: 262144 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PDSO-G44
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TSOP2
Width: 10.16 mm
Memory Density: 4194304 bit
Memory IC Type: MASK ROM
JESD-609 Code: e0
Minimum Operating Temperature: -20 Cel
Memory Width: 16
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: TSOP44,.46,32
Alternate Memory Width: 8
Length: 18.41 mm
Maximum Access Time: 120 ns
No. of Words Code: 256K
Nominal Supply Voltage / Vsup (V): 5
Additional Features: ALL INPUTS AND OUTPUTS TTL COMPATIBLE
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 5.5 V
Power Supplies (V): 5
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