Renesas Electronics - UPD23C32300F9-XXX-BC3-A

UPD23C32300F9-XXX-BC3-A by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number UPD23C32300F9-XXX-BC3-A
Description MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
Datasheet UPD23C32300F9-XXX-BC3-A Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00003 Amp
Organization: 2MX16
Maximum Seated Height: 1.07 mm
Minimum Supply Voltage (Vsup): 2.7 V
Sub-Category: MASK ROMs
Surface Mount: YES
Maximum Supply Current: 30 mA
Terminal Finish: MATTE TIN/TIN BISMUTH
No. of Terminals: 48
No. of Words: 2097152 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: MOS
JESD-30 Code: R-PBGA-B48
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: TFBGA
Width: 6 mm
Memory Density: 33554432 bit
Memory IC Type: MASK ROM
JESD-609 Code: e3/e6
Minimum Operating Temperature: -10 Cel
Memory Width: 16
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA48,6X8,32
Alternate Memory Width: 8
Length: 8 mm
Maximum Access Time: 100 ns
No. of Words Code: 2M
Nominal Supply Voltage / Vsup (V): 3
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
Power Supplies (V): 3/3.3
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