Renesas Electronics - UPD23C16343F9-XXX-BC3

UPD23C16343F9-XXX-BC3 by Renesas Electronics

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Manufacturer	Renesas Electronics
Manufacturer's Part Number	UPD23C16343F9-XXX-BC3
Description	MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Technology: CMOS;
Datasheet	UPD23C16343F9-XXX-BC3 Datasheet

UPD23C16343F9-XXX-BC3 Technical Details

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00003 Amp
Organization:	1MX16
Sub-Category:	MASK ROMs
Surface Mount:	YES
Maximum Supply Current:	40 mA
No. of Terminals:	48
No. of Words:	1048576 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B48
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	70 Cel
Package Code:	FBGA
Memory Density:	16777216 bit
Memory IC Type:	MASK ROM
Minimum Operating Temperature:	-10 Cel
Memory Width:	16
Qualification:	Not Qualified
Package Equivalence Code:	BGA48,6X8,32
Maximum Access Time:	90 ns
No. of Words Code:	1M
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL
Power Supplies (V):	1.8,3/3.3

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