Renesas Electronics - UPD23C1001EC

UPD23C1001EC by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number UPD23C1001EC
Description MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 1048576 bit;
Datasheet UPD23C1001EC Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .0001 Amp
Organization: 128KX8
Sub-Category: MASK ROMs
Surface Mount: NO
Maximum Supply Current: 40 mA
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 32
No. of Words: 131072 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-PDIP-T32
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Memory Density: 1048576 bit
Memory IC Type: MASK ROM
JESD-609 Code: e0
Minimum Operating Temperature: -10 Cel
Memory Width: 8
Qualification: Not Qualified
Package Equivalence Code: DIP32,.6
Maximum Access Time: 200 ns
No. of Words Code: 128K
Nominal Supply Voltage / Vsup (V): 5
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 5
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