Renesas Electronics - HN62444BFBN-12

HN62444BFBN-12 by Renesas Electronics

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Manufacturer Renesas Electronics
Manufacturer's Part Number HN62444BFBN-12
Description MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 3.22 mm;
Datasheet HN62444BFBN-12 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 256KX16
Maximum Seated Height: 3.22 mm
Minimum Supply Voltage (Vsup): 4.75 V
Surface Mount: YES
No. of Terminals: 44
No. of Words: 262144 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Technology: CMOS
JESD-30 Code: R-PDSO-G44
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: SOP
Width: 12.6 mm
Memory Density: 4194304 bit
Memory IC Type: MASK ROM
Minimum Operating Temperature: 0 Cel
Memory Width: 16
No. of Functions: 1
Qualification: Not Qualified
Length: 28.5 mm
Maximum Access Time: 120 ns
No. of Words Code: 256K
Nominal Supply Voltage / Vsup (V): 5
Parallel or Serial: PARALLEL
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 5.25 V
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