Renesas Electronics - HA11441

  1. Home
  2. Renesas Electronics - HA11441
HA11441 by Renesas Electronics

Image shown is a representation only.

Manufacturer Renesas Electronics
Manufacturer's Part Number HA11441
Description HORIZ/VERT DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Datasheet HA11441 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Seated Height: 5.08 mm
Surface Mount: NO
No. of Terminals: 18
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Length: 24.5 mm
JESD-30 Code: R-PDIP-T18
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Package Code: DIP
General IC Type: HORIZ/VERT DEFLECTION IC
Width: 7.62 mm
Terminal Pitch: 2.54 mm
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

TDA1175 by STMicroelectronics

TDA1175

STMicroelectronics

VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Code: QIP; Package Shape: RECTANGULAR; Package Equivalence Code: QI16B,.2/.4,100TB;
TEA2031A by STMicroelectronics

TEA2031A

STMicroelectronics

EAST-WEST CORRECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
STV9325 by STMicroelectronics

STV9325

STMicroelectronics

VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR; Blanking Output: NO;
TA1241ANG by Toshiba

TA1241ANG

Toshiba

HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: SDIP; Package Shape: RECTANGULAR;
LA78040B by Onsemi

LA78040B

Onsemi

VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR;
STV8179F by STMicroelectronics

STV8179F

STMicroelectronics

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR;
KA2131 by Samsung

KA2131

Samsung

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; Package Style (Meter): FLANGE MOUNT;
STV9303W by STMicroelectronics

STV9303W

STMicroelectronics

VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 11; Package Code: ZIP; Package Shape: RECTANGULAR; Blanking Output: NO;
TA7609P by Toshiba

TA7609P

Toshiba

HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
TDA4853/V2 by NXP Semiconductors

TDA4853/V2

NXP Semiconductors

HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 32; Package Code: SDIP; Package Shape: RECTANGULAR;
TDA9115 by STMicroelectronics

TDA9115

STMicroelectronics

HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 32; Package Code: SDIP; Package Shape: RECTANGULAR;
935084350112 by NXP Semiconductors

935084350112

NXP Semiconductors

VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 60 V; Terminal Position: SINGLE;
TDA4860 by NXP Semiconductors

TDA4860

NXP Semiconductors

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; JESD-30 Code: R-PSFM-T9;
KA2130AS by Samsung

KA2130AS

Samsung

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL; No. of Terminals: 10; Qualification: Not Qualified; Surface Mount: NO; Package Equivalence Code: SIP10,.07TB;
TDA3653B by NXP Semiconductors

TDA3653B

NXP Semiconductors

VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;
TBA920S by STMicroelectronics

TBA920S

STMicroelectronics

HORIZONTAL DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
TDA8350Q by NXP Semiconductors

TDA8350Q

NXP Semiconductors

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 13; Package Code: ZIP; Package Shape: RECTANGULAR;
TEA2017 by STMicroelectronics

TEA2017

STMicroelectronics

HORIZ/VERT DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 15; Package Code: ZIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PZIP-T15;
TDA2579BN by NXP Semiconductors

TDA2579BN

NXP Semiconductors

HORIZ/VERT DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
TDA1170D by STMicroelectronics

TDA1170D

STMicroelectronics

VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Blanking Output: NO;