Quectel Wireless Solutions - BG96MA-128-SGN

RTL8152B-VB-CG by Realtek: Telecom IC with 24 terminals, 3.3V supply voltage, and 0-70°C operating temp. Ideal for telecom circuits in commercial applications due to its compact square chip carrier package.

GNSS Module;

TELECOM CIRCUIT; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;

EYSHSNZWZ by Taiyo Yuden is a RECTANGULAR telecom IC with 28 terminals, HYBRID technology, and 3V supply voltage. It operates b/w -40°C to 85°C, suitable for telecom circuit applications requiring compact design with surface mount capability.

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 12; Package Code: BCC; Package Shape: RECTANGULAR;

Qorvo's TGA2975-SM is a 24-terminal telecom IC with a nominal voltage of 28V. It features a chip carrier package style, 0.65mm terminal pitch, and 0.9mm max seated height. Ideal for telecom circuit applications due to its compact size and surface-mount capability.

TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 33; Package Code: XMA; Package Shape: RECTANGULAR;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

PN5321A3HN/C106,51 by NXP Semiconductors is a telecom IC with 40 terminals in a square chip carrier package. Operating b/w -30 to 85°C, it has a nominal voltage of 5V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and has a low profile design.

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 76; Package Code: HVQCCN; Package Shape: SQUARE;

TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;

Other Telecom ICs;

TELECOM CIRCUIT;

TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3;

TELECOM CIRCUIT; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

TELECOM CIRCUIT;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 159; Package Code: LFBGA; Package Shape: SQUARE;

TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 61; Package Code: XMA; Package Shape: RECTANGULAR; Nominal Supply Voltage: 3 V;