Qualcomm - PM-8916-0-176NSP-TR-02-1-01

PM-8916-0-176NSP-TR-02-1-01 by Qualcomm

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Manufacturer Qualcomm
Manufacturer's Part Number PM-8916-0-176NSP-TR-02-1-01
Description TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 176; Package Code: VFBGA; Package Shape: SQUARE; Maximum Seated Height: .86 mm;
Datasheet PM-8916-0-176NSP-TR-02-1-01 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.6 V
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: .86 mm
Surface Mount: YES
No. of Functions: 1
No. of Terminals: 176
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Length: 6.2 mm
Technology: HVCMOS
JESD-30 Code: S-PBGA-B176
Package Shape: SQUARE
Terminal Form: BALL
Package Code: VFBGA
Width: 6.2 mm
Terminal Pitch: .4 mm
Moisture Sensitivity Level (MSL): 3
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