74LVC1G157GW by Philips Semiconductors | Vyrian | Semiconductor & Electronic Component Distributor

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Manufacturer	Philips Semiconductors
Manufacturer's Part Number	74LVC1G157GW
Description	MULTIPLEXER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet	74LVC1G157GW Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
No. of Inputs:	2
Sub-Category:	Multiplexer/Demultiplexers
Surface Mount:	YES
Terminal Finish:	Tin/Lead (Sn/Pb)
No. of Terminals:	6
Maximum I (ol):	24 Amp
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology:	CMOS
JESD-30 Code:	R-PDSO-G6
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	125 Cel
Package Code:	TSSOP
Propagation Delay At Nominal Supply:	6.3 ns
Load Capacitance (CL):	50 pF
Logic IC Type:	MULTIPLEXER
JESD-609 Code:	e0
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	TSSOP6,.08
Nominal Supply Voltage / Vsup (V):	3.3
Terminal Pitch:	.635 mm
Temperature Grade:	AUTOMOTIVE
Power Supplies (V):	3.3

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