Onsemi - STK79315A

  1. Home
  2. Onsemi - STK79315A
STK79315A by Onsemi

Image shown is a representation only.

Manufacturer Onsemi
Manufacturer's Part Number STK79315A
Description VERTICAL DEFLECTION IC; No. of Terminals: 18; Terminal Pitch: 2.54 mm; Qualification: Not Qualified; Package Equivalence Code: SIP18,.1; Surface Mount: NO;
Datasheet STK79315A Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
No. of Terminals: 18
Qualification: Not Qualified
Package Equivalence Code: SIP18,.1
Terminal Position: SINGLE
Technology: HYBRID
Sub-Category: Deflection ICs
Surface Mount: NO
General IC Type: VERTICAL DEFLECTION IC
Terminal Pitch: 2.54 mm
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

TA1300AN by Toshiba

TA1300AN

Toshiba

HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: SDIP; Package Shape: RECTANGULAR;
TDA8354Q/N2 by NXP Semiconductors

TDA8354Q/N2

NXP Semiconductors

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 13; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA8177 by STMicroelectronics

TDA8177

STMicroelectronics

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR;
E-STV9381 by STMicroelectronics

E-STV9381

STMicroelectronics

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
TDA3654AU by NXP Semiconductors

TDA3654AU

NXP Semiconductors

VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA1175 by STMicroelectronics

TDA1175

STMicroelectronics

VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Code: QIP; Package Shape: RECTANGULAR; Package Equivalence Code: QI16B,.2/.4,100TB;
TDA9116 by STMicroelectronics

TDA9116

STMicroelectronics

HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 32; Package Code: SDIP; Package Shape: RECTANGULAR;
TDA2577AN by NXP Semiconductors

TDA2577AN

NXP Semiconductors

HORIZ/VERT DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
TDA8350Q by NXP Semiconductors

TDA8350Q

NXP Semiconductors

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 13; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA4863J by NXP Semiconductors

TDA4863J

NXP Semiconductors

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR;
STV9325 by STMicroelectronics

STV9325

STMicroelectronics

VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR; Blanking Output: NO;
TDA9103 by STMicroelectronics

TDA9103

STMicroelectronics

HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 42; Package Code: DIP; Package Shape: RECTANGULAR;
TA8432K by Toshiba

TA8432K

Toshiba

VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Shape: RECTANGULAR; Technology: BIPOLAR;
TDA9111 by STMicroelectronics

TDA9111

STMicroelectronics

HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 32; Package Code: SDIP; Package Shape: RECTANGULAR;
TDA8147M by STMicroelectronics

TDA8147M

STMicroelectronics

EAST-WEST CORRECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
TDA4861U by NXP Semiconductors

TDA4861U

NXP Semiconductors

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: SIP; Package Shape: RECTANGULAR;
TDA9302H by STMicroelectronics

TDA9302H

STMicroelectronics

VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
SDA9064-5 by Infineon Technologies

SDA9064-5

Infineon Technologies

HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;
TDA8351AQ by NXP Semiconductors

TDA8351AQ

NXP Semiconductors

VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 13; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA1082 by NXP Semiconductors

TDA1082

NXP Semiconductors

EAST-WEST CORRECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;