Image shown is a representation only.
| Manufacturer | Onsemi |
|---|---|
| Manufacturer's Part Number | LC709203FXE-01MH |
| Description | POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 9; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES; |
| Datasheet | LC709203FXE-01MH Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Width (mm): | 1.6 mm |
| Maximum Seated Height: | .51 mm |
| Minimum Supply Voltage (Vsup): | 2.5 V |
| Sub-Category: | Power Management Circuits |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 9 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B9 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| No. of Channels: | 1 |
| Package Code: | VFBGA |
| Nominal Supply Voltage (Vsup): | 3.6 V |
| Moisture Sensitivity Level (MSL): | 1 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA9,3X3,20 |
| Other IC type: | POWER SUPPLY SUPPORT CIRCUIT |
| Length: | 1.76 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 4.5 V |
| Power Supplies (V): | 2.5/4.5 |
