Onsemi - LA7841-E

  1. Home
  2. Onsemi - LA7841-E
LA7841-E by Onsemi

Image shown is a representation only.

Manufacturer Onsemi
Manufacturer's Part Number LA7841-E
Description VERTICAL DEFLECTION IC; Terminal Finish: Tin/Bismuth (Sn/Bi); JESD-609 Code: e6;
Datasheet LA7841-E Datasheet
NAME DESCRIPTION
General IC Type: VERTICAL DEFLECTION IC
Terminal Finish: Tin/Bismuth (Sn/Bi)
JESD-609 Code: e6
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

KA2131 by Samsung

KA2131

Samsung

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; Package Style (Meter): FLANGE MOUNT;
TDA8433 by NXP Semiconductors

TDA8433

NXP Semiconductors

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
TDA2579C by NXP Semiconductors

TDA2579C

NXP Semiconductors

HORIZ/VERT DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
TA1317AN by Toshiba

TA1317AN

Toshiba

HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: SDIP; Package Shape: RECTANGULAR;
TDA4950 by STMicroelectronics

TDA4950

STMicroelectronics

EAST-WEST CORRECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
TDA1170N by STMicroelectronics

TDA1170N

STMicroelectronics

VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Code: QIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PQIP-T12;
TDA2658 by NXP Semiconductors

TDA2658

NXP Semiconductors

VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 13; Package Shape: RECTANGULAR; JESD-30 Code: R-PSFM-T13; Minimum Supply Voltage (Vsup): 9 V;
TDA8185 by STMicroelectronics

TDA8185

STMicroelectronics

HORIZ/VERT DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
TDA8175 by STMicroelectronics

TDA8175

STMicroelectronics

VERTICAL DEFLECTION IC; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA1170SH by STMicroelectronics

TDA1170SH

STMicroelectronics

VERTICAL DEFLECTION IC; Terminal Form: PIN/PEG; No. of Terminals: 16; Package Code: QIP; Package Shape: RECTANGULAR; Surface Mount: NO;
TDA4810 by NXP Semiconductors

TDA4810

NXP Semiconductors

HORIZONTAL DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
STV8172A by STMicroelectronics

STV8172A

STMicroelectronics

VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LA7841 by Onsemi

LA7841

Onsemi

VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Shape: RECTANGULAR; Surface Mount: NO;
TDA4863AJ by NXP Semiconductors

TDA4863AJ

NXP Semiconductors

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Code: ZIP; Package Shape: RECTANGULAR;
TDA8351U by NXP Semiconductors

TDA8351U

NXP Semiconductors

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: SIP; Package Shape: RECTANGULAR;
TDA3653C/N2 by NXP Semiconductors

TDA3653C/N2

NXP Semiconductors

VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: SIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PSIP-T9;
TDA4852 by NXP Semiconductors

TDA4852

NXP Semiconductors

HORIZ/VERT DEFLECTION IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
TDA2170 by STMicroelectronics

TDA2170

STMicroelectronics

VERTICAL DEFLECTION IC; Terminal Form: THROUGH-HOLE; No. of Terminals: 11; Package Code: ZIP; Package Shape: RECTANGULAR; Surface Mount: NO;
TDA8356 by NXP Semiconductors

TDA8356

NXP Semiconductors

VERTICAL DEFLECTION IC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Code: SIP; Package Shape: RECTANGULAR;
TA8432K by Toshiba

TA8432K

Toshiba

VERTICAL DEFLECTION IC; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 12; Package Shape: RECTANGULAR; Technology: BIPOLAR;