Onsemi - FUSB302BMPX

FUSB302BMPX by Onsemi

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Manufacturer Onsemi
Manufacturer's Part Number FUSB302BMPX
Description POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 14; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
Datasheet FUSB302BMPX Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Maximum Time At Peak Reflow Temperature (s): 30
Width (mm): 2.5 mm
Maximum Seated Height: .8 mm
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
Terminal Finish: NICKEL PALLADIUM GOLD
No. of Terminals: 14
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
JESD-30 Code: S-XQCC-N14
Package Shape: SQUARE
Terminal Form: NO LEAD
Maximum Operating Temperature: 85 Cel
No. of Channels: 1
Package Code: HVQCCN
Nominal Supply Voltage (Vsup): 3.3 V
Moisture Sensitivity Level (MSL): 1
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Other IC type: POWER SUPPLY SUPPORT CIRCUIT
Length: 2.5 mm
Adjustable Threshold: YES
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 5.5 V
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