Ohmite Manufacturing - 281-2AB

HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Finish: ANODIZED;

HEAT SINK;

Boyd's HF20G heat sink boasts a low thermal resistance of 13.1 ohm, ideal for dissipating heat efficiently. With a height of 27.94mm and extruded aluminum construction, it is suitable for compact electronic devices requiring effective cooling. The anodized finish and black color add to its aesthetic appeal in various applications.

ICKBGA14X14X10 by Fischer Elektronik & Kg is a black anodized heat sink with dimensions of 14mm x 14mm x 10mm. It features fin construction and is designed for IC devices, providing efficient thermal management in electronic applications.

HEAT SINK;

HEAT SINK;

Boyd's 552844B00000G Heat Sink has a Thermal Resistance of 8.7 ohm, Height of 18.29mm, and Width of 45.2mm. Ideal for cooling electronic components in various applications due to its anodized finish and aluminum construction.

HEAT SINK; Body Material: COPPER; Height: 10.16 mm; Finish: TIN; Length: 22.86 mm; Thermal Resistance: 15 ohm;

FK24408D3PAK by Fischer Elektronik & Kg is a copper heat sink measuring 31x8x10mm and weighing 2.5g. Primarily used on ICs, it comes in bulk packaging and offers efficient thermal dissipation for electronic components.

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Color: BLACK; Finish: ANODIZED; Length: 61 mm;

HEAT SINK; Profile: U; Body Material: COPPER; Construction: CLIP; Fin Orientation: TRANSVERSE; Thermal Resistance: 19.7 ohm;

HEAT SINK;

Boyd 568303B00000G Heat Sink has Thermal Resistance of 5.4 ohm, Height 31.75mm, and Width 45.97mm. Ideal for cooling electronic components in compact spaces with high thermal output requirements.

HEAT SINK; Body Material: ALUMINUM; Finish: ANODIZED; Height: 25 mm; Color: BLACK; Thermal Resistance: 7.4 ohm;

HEAT SINK;

HEAT SINK; Profile: CLIP; Body Material: ALUMINUM; Device Used On: IC; Fin Orientation: RADIAL; Approvals (V): UL;

DA-T263-101E-TR by Ohmite Manufacturing is a heat sink with dimensions of 10.16mm x 12.7mm x 25.91mm and a weight of 3.8g. It is made of anodized aluminum and is used on transistors for thermal management purposes.

Boyd's 574602B03300G heat sink has a thermal resistance of 21.6 ohm, U profile, and aluminum body material. Ideal for applications requiring efficient heat dissipation in compact spaces like electronic devices or LED lighting systems.

HEAT SINK; Body Material: ALUMINUM; Construction: SLIDE ON; Fin Orientation: FOLDEDBACK; Width: 9.9 mm; Color: BLACK;

HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Weight: 6.7 g; Color: BLACK;