NXP Semiconductors - UJA1018TK,118

UJA1018TK,118 by NXP Semiconductors

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	UJA1018TK,118
Description	Automotive Circuits; No. of Terminals: 16; Package Code: SON; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Pitch: .635 mm;
Datasheet	UJA1018TK,118 Datasheet

UJA1018TK,118 Technical Details

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Supply Current (Isup):	4.5 mA
Sub-Category:	Automotive Circuits
Surface Mount:	YES
No. of Terminals:	16
Qualification:	Not Qualified
Package Equivalence Code:	SOLCC16,.14,25
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE
JESD-30 Code:	R-PDSO-N16
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Peak Reflow Temperature (C):	260
Package Code:	SON
Terminal Pitch:	.635 mm
Power Supplies (V):	5.5/18
Moisture Sensitivity Level (MSL):	1

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