NXP Semiconductors - TEA1113

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TEA1113 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1113
Description TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet TEA1113 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 4 V
Telecom IC Type: TELEPHONE SPEECH CIRCUIT
Sub-Category: Telephone Circuits
Surface Mount: NO
Maximum Supply Current: .0016 mA
Minimum Operating Temperature: -25 Cel
No. of Terminals: 16
Qualification: Not Qualified
Package Equivalence Code: DIP16,.3
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: BIPOLAR
JESD-30 Code: R-PDIP-T16
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Terminal Pitch: 2.54 mm
Temperature Grade: OTHER
Power Supplies (V): 4
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