NXP Semiconductors - TEA1095

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TEA1095 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1095
Description SPEAKER PHONE CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet TEA1095 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Seated Height: 5.1 mm
Sub-Category: Telephone Circuits
Surface Mount: NO
Maximum Supply Current: .0038 mA
No. of Terminals: 24
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: BIPOLAR
JESD-30 Code: R-PDIP-T24
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 75 Cel
Package Code: DIP
Width: 15.24 mm
Telecom IC Type: SPEAKER PHONE CIRCUIT
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: DIP24,.6
Length: 31.7 mm
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL EXTENDED
Power Supplies (V): 2.9/12
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