NXP Semiconductors - TEA1062AM1

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TEA1062AM1 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1062AM1
Description TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet TEA1062AM1 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.4 V
Maximum Seated Height: 4.2 mm
Sub-Category: Telephone Circuits
Surface Mount: NO
Maximum Supply Current: 1.35 mA
No. of Terminals: 16
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: BIPOLAR
JESD-30 Code: R-PDIP-T16
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 75 Cel
Package Code: DIP
Width: 7.62 mm
Telecom IC Type: TELEPHONE SPEECH CIRCUIT
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: DIP16,.3
Length: 19.025 mm
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL EXTENDED
Power Supplies (V): 2.7
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