Image shown is a representation only.
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | TDA8262HN/C1,118 |
| Description | MODEM-DEMODULATOR; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; |
| Datasheet | TDA8262HN/C1,118 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Telecom IC Type: | MODEM-DEMODULATOR |
| Maximum Seated Height: | 1 mm |
| Surface Mount: | YES |
| Terminal Finish: | NICKEL PALLADIUM GOLD |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -20 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 32 |
| Qualification: | Not Qualified |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Length: | 5 mm |
| JESD-30 Code: | S-PQCC-N32 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HVQCCN |
| Width: | 5 mm |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |
| Moisture Sensitivity Level (MSL): | 1 |
