NXP Semiconductors - TDA1013BU

TDA1013BU by NXP Semiconductors

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	TDA1013BU
Description	VOLUME CONTROL CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 9; Package Shape: RECTANGULAR; Package Style (Meter): FLANGE MOUNT; JESD-30 Code: R-PSFM-T9;
Datasheet	TDA1013BU Datasheet

TDA1013BU Technical Details

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Minimum Supply Voltage (Vsup):	10 V
Surface Mount:	NO
No. of Terminals:	9
Qualification:	Not Qualified
Terminal Position:	SINGLE
Package Style (Meter):	FLANGE MOUNT
JESD-30 Code:	R-PSFM-T9
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Peak Reflow Temperature (C):	NOT SPECIFIED
General IC Type:	VOLUME CONTROL CIRCUIT
Maximum Supply Voltage (Vsup):	40 V

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