NXP Semiconductors - SPC5125YVN400

SPC5125YVN400 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SPC5125YVN400
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN SILVER
No. of Terminals: 324
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Screening Level: AEC-Q100
JESD-30 Code: S-PBGA-B324
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Moisture Sensitivity Level (MSL): 3
Speed: 400 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Bit Size: 32
JESD-609 Code: e2
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA324,22X22,40
Peak Reflow Temperature (C): 260
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.4,3.3
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