NXP Semiconductors - SGTL5000XNBA3R2

SGTL5000XNBA3R2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SGTL5000XNBA3R2
Description PCM CODEC; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
Datasheet SGTL5000XNBA3R2 Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Nominal Supply Voltage: 1.8 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: .9 mm
Resolution (um): 24
Surface Mount: YES
No. of Terminals: 32
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
JESD-30 Code: S-XQCC-N32
Package Shape: SQUARE
Terminal Form: NO LEAD
Operating Mode: SYNCHRONOUS
Linear Coding: NOT AVAILABLE
Maximum Operating Temperature: 85 Cel
No. of Channels: 2
Package Code: HVQCCN
Width: 5 mm
Moisture Sensitivity Level (MSL): 3
Input Type: SINGLE-ENDED
Telecom IC Type: PCM CODEC
Maximum Output Voltage: 3.11 V
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Package Equivalence Code: LCC32,.2SQ,20
Length: 5 mm
Filter: YES
Output (V): VOLTAGE
Additional Features: ALSO OPERATE WITH 1.1V TO 2V DIGITAL SUPPLY
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
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