NXP Semiconductors - SCN68661BC1F28

SCN68661BC1F28 by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number SCN68661BC1F28
Description SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet SCN68661BC1F28 Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 4.75 V
Package Body Material: CERAMIC, GLASS-SEALED
Nominal Supply Voltage: 5 V
Maximum Seated Height: 5.72 mm
Surface Mount: NO
Maximum Supply Current: 150 mA
Data Encoding or Decoding Method: NRZ
On Chip Data RAM Width: 0
No. of Terminals: 28
No. of Serial I/Os: 1
Terminal Position: DUAL
Package Style (Meter): IN-LINE
No. of DMA Channels: 0
No. of I/O Lines: 0
Address Bus Width: 2
Maximum Data Transfer Rate: .125 MBps
Technology: NMOS
RAM Words: 0
JESD-30 Code: R-GDIP-T28
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Width: 15.24 mm
Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Maximum Supply Voltage: 5.25 V
Low Power Mode: NO
Boundary Scan: NO
External Data Bus Width: 8
Communication Protocol: ASYNC, BIT; SYNC, BYTE; BISYNC
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Length: 37.15 mm
Additional Features: MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products