NXP Semiconductors - SAA1575HLBE

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SAA1575HLBE by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SAA1575HLBE
Description CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
Datasheet SAA1575HLBE Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Telecom IC Type: CORDLESS TELEPHONE BASEBAND CIRCUIT
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 100
Qualification: Not Qualified
Terminal Position: QUAD
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
Length: 14 mm
Technology: CMOS
JESD-30 Code: S-PQFP-G100
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: LFQFP
Width: 14 mm
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
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