NXP Semiconductors - SA602AFE

IMAGE REJECTION; Construction: COMPONENT; Maximum Operating Temperature: 85 Cel; Maximum Input Power (CW): 20 dBm; Minimum Operating Frequency: 8500 MHz; JESD-609 Code: e4;

Analog Devices' HMC557ALC4 is a GAAS double balanced RF/Microwave Mixer with 24 terminals. It operates b/w -40°C to 85°C, featuring a ceramic package and W/Ni/Au terminal finish. Ideal for surface mount applications in various RF and microwave systems.

DOUBLE BALANCED; Construction: COMPONENT;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 3; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Frequency: 600 MHz;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Frequency: 1500 MHz;

DOUBLE BALANCED; Screening Level: 38535V;34K;Cls S ; Maximum Conversion Loss: 14 dB; Maximum Operating Frequency: 18000 MHz; Characteristic Impedance: 50 ohm; Package Equivalence Code: DIE OR CHIP;

DOUBLE BALANCED; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel; Maximum Conversion Loss: 11 dB; JESD-609 Code: e3; Construction: COMPONENT;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Construction: COMPONENT;

TRIPLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Construction: COMPONENT; Package Equivalence Code: LCC8,.2SQ,28;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: LCC8,.2SQ,28; Terminal Finish: Tin/Lead (Sn/Pb);

DOUBLE BALANCED; JESD-609 Code: e0; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 700 MHz; Maximum Conversion Loss: 10 dB; Minimum Operating Temperature: -40 Cel;

DOUBLE BALANCED; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 85 Cel; Construction: COMPONENT; Maximum Operating Frequency: 2000 MHz;

DOUBLE BALANCED; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 2500 MHz; Construction: COMPONENT; Additional Features: HIGH ISOLATION; Maximum Operating Temperature: 85 Cel;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: CERAMIC; Technology: GAAS; Package Equivalence Code: LCC12,.12SQ,20;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 32; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Minimum Operating Frequency: 300 MHz;

DOUBLE BALANCED; JESD-609 Code: e4; Minimum Operating Frequency: 1700 MHz; Maximum Operating Frequency: 2200 MHz; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 85 Cel;

SINGLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: TSSOP8,.19;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 14; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: SOP14,.25; Maximum Supply Current: 3.9 mA;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Minimum Operating Temperature: -40 Cel;