NXP Semiconductors - SA602AD,623

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED; Maximum Input Power (CW): 13 dBm; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 85 Cel; Minimum Operating Frequency: 24000 MHz; Maximum Conversion Loss: 13.5 dB;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Input Power (CW): 27 dBm;

RF/Microwave Mixers; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 8; Package Body Material: CERAMIC; Technology: BIPOLAR; Minimum Operating Temperature: 0 Cel;

SINGLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; JESD-609 Code: e3;

DOUBLE BALANCED; Maximum Operating Temperature: 85 Cel; Maximum Conversion Loss: 14.5 dB; Minimum Operating Temperature: -55 Cel; Maximum Operating Frequency: 38000 MHz; Maximum Input Power (CW): 18 dBm;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Operating Temperature: 85 Cel;

RF/Microwave Mixers; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 14; Package Body Material: CERAMIC; Technology: BIPOLAR; Screening Level: MIL-STD-883 Class B (Modified);

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: CERAMIC; Technology: GAAS; Package Equivalence Code: LCC12,.12SQ,20;

IMAGE REJECTION; Maximum Operating Frequency: 23600 MHz; Characteristic Impedance: 50 ohm; Terminal Finish: Gold (Au); Maximum Input Power (CW): 20 dBm; Minimum Operating Frequency: 15000 MHz;

TRIPLE BALANCED; Construction: MODULE; Minimum Operating Frequency: 50 MHz; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 2500 MHz; Minimum Operating Temperature: -55 Cel;

TRIPLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Power Supplies (V): 5;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Frequency: 1500 MHz;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: CERAMIC; Minimum Operating Frequency: 2 MHz; Maximum Input Power (CW): 23 dBm;

DOUBLE BALANCED; Terminal Finish: GOLD OVER NICKEL; Maximum Operating Frequency: 4000 MHz; Minimum Operating Temperature: -55 Cel; Maximum Input Power (CW): 13 dBm; Minimum Operating Frequency: 2500 MHz;

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: CERAMIC; Technology: GAAS; Maximum Operating Temperature: 85 Cel;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Terminal Finish: MATTE TIN;

DOUBLE BALANCED; Minimum Operating Temperature: -40 Cel; Minimum Operating Frequency: 2000 MHz; Characteristic Impedance: 50 ohm; Additional Features: CMOS COMPATIBLE; JESD-609 Code: e3;

DOUBLE BALANCED; Minimum Operating Temperature: -40 Cel; Construction: COMPONENT; Minimum Operating Frequency: 14000 MHz; Maximum Conversion Loss: 12.5 dB; Maximum Operating Temperature: 85 Cel;

SINGLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 32; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Minimum Operating Frequency: 1500 MHz;