NXP Semiconductors - PTN3310DP

PTN3310DP by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number PTN3310DP
Description LVDS TO PECL TRANSLATOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
Datasheet PTN3310DP Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: 1.1 mm
Output Latch/Register: NONE
Sub-Category: Other Interface ICs
Surface Mount: YES
Terminal Finish: NICKEL PALLADIUM GOLD
No. of Terminals: 8
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
JESD-30 Code: S-PDSO-G8
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Interface IC Type: LVDS TO PECL TRANSLATOR
Width: 3 mm
Moisture Sensitivity Level (MSL): 1
No. of Bits: 1
Output Polarity: COMPLEMENTARY
Maximum Supply Voltage: 3.6 V
Maximum Delay: 3 ns
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: SOP8,.25
Length: 3 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products