NXP Semiconductors - MVF61NN151CMK50

MVF61NN151CMK50 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MVF61NN151CMK50
Description MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 364; Package Code: BGA; Package Shape: SQUARE;
NAME DESCRIPTION
Minimum Supply Voltage: 1.16 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.23 V
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 850 mA
Terminal Finish: TIN SILVER COPPER
ADC Channels: YES
No. of Terminals: 364
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
No. of I/O Lines: 131
Address Bus Width: 16
Technology: CMOS
JESD-30 Code: S-PBGA-B364
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Speed: 500 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 1.26 V
RAM Bytes: 1572864
External Data Bus Width: 16
Bit Size: 16
DAC Channels: YES
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA364,20X20,32
Length: 17 mm
PWM Channels: NO
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
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