NXP Semiconductors - MR0S16ATS35C

MR0S16ATS35C by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MR0S16ATS35C
Description MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .012 Amp
Organization: 64KX16
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: YES
Maximum Supply Current: 155 mA
Maximum Write Cycle Time (tWC): .035 ms
No. of Terminals: 44
No. of Words: 65536 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PDSO-G44
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: TSOP2
Width: 10.16 mm
Memory Density: 1048576 bit
Minimum Standby Voltage: 3 V
Memory IC Type: MRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 16
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: TSOP44,.46,32
Length: 18.41 mm
Maximum Access Time: 35 ns
No. of Words Code: 64K
Nominal Supply Voltage / Vsup (V): 3.3
Minimum Data Retention Time: 20
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
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