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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MPC8270VRMIBA |
| Description | MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.45 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.5 V |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.55 mm |
| Sub-Category: | Other uPs/uCs/Peripheral ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER |
| No. of Terminals: | 516 |
| Terminal Position: | BOTTOM |
| Format: | FLOATING POINT |
| Package Style (Meter): | GRID ARRAY |
| Address Bus Width: | 32 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B516 |
| Maximum Clock Frequency: | 266 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 27 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 66.67 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 1.6 V |
| Low Power Mode: | NO |
| Boundary Scan: | YES |
| External Data Bus Width: | 64 |
| Bit Size: | 32 |
| JESD-609 Code: | e2 |
| Minimum Operating Temperature: | 0 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA516,26X26,40 |
| Length: | 27 mm |
| Peak Reflow Temperature (C): | 245 |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 1.5,3.3 |
