NXP Semiconductors - MCIMX515DJM8CR2

MCIMX515DJM8CR2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX515DJM8CR2
Description SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE; Technology: CMOS;
NAME DESCRIPTION
Minimum Supply Voltage: 1.05 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.1 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.6 mm
Sub-Category: Graphics Processors
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 529
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B529
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.15 V
JESD-609 Code: e1
Minimum Operating Temperature: -20 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA529,23X23,32
Length: 19 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Power Supplies (V): 1.2
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