MCF5272VM66 by NXP Semiconductors | Vyrian | Semiconductor & Electronic Component Distributor

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MCF5272VM66
Description	MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: SQUARE;

NAME	DESCRIPTION
Minimum Supply Voltage:	3 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Integrated Cache:	YES
Maximum Time At Peak Reflow Temperature (s):	40
Maximum Seated Height:	1.75 mm
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	196
Terminal Position:	BOTTOM
Format:	FIXED POINT
Package Style (Meter):	GRID ARRAY
Address Bus Width:	23
Technology:	CMOS
JESD-30 Code:	S-PBGA-B196
Maximum Clock Frequency:	66 MHz
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Width:	15 mm
Moisture Sensitivity Level (MSL):	3
Speed:	66 rpm
Peripheral IC Type:	MICROPROCESSOR, RISC
Maximum Supply Voltage:	3.6 V
Low Power Mode:	YES
Boundary Scan:	YES
External Data Bus Width:	32
Bit Size:	32
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
Qualification:	Not Qualified
Length:	15 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	1 mm
Temperature Grade:	COMMERCIAL

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