NXP Semiconductors - MC9S08PA8VTG

MC9S08PA8VTG by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC9S08PA8VTG
Description MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet MC9S08PA8VTG Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 2.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 14 mA
Terminal Finish: TIN
ADC Channels: YES
No. of Terminals: 16
DMA Channels: NO
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
No. of I/O Lines: 14
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: R-PDSO-G16
Maximum Clock Frequency: 20 MHz
Package Shape: RECTANGULAR
ROM Words: 8192
Terminal Form: GULL WING
Maximum Operating Temperature: 105 Cel
Package Code: TSSOP
Width: 4.4 mm
Moisture Sensitivity Level (MSL): 3
Speed: 20 rpm
Peripheral IC Type: MICROCONTROLLER
Maximum Supply Voltage: 5.5 V
RAM Bytes: 2048
External Data Bus Width: 0
Bit Size: 8
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: TSSOP16,.25
Length: 5 mm
PWM Channels: YES
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/5
CPU Family: HCS08
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