NXP Semiconductors - MC9S08DZ60CLC

MC9S08DZ60CLC by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC9S08DZ60CLC
Description MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
Datasheet MC9S08DZ60CLC Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 2.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.6 mm
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 24 mA
Terminal Finish: MATTE TIN
ADC Channels: YES
No. of Terminals: 32
DMA Channels: NO
Terminal Position: QUAD
Package Style (Meter): FLATPACK, LOW PROFILE
No. of I/O Lines: 26
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PQFP-G32
Maximum Clock Frequency: 16 MHz
Package Shape: SQUARE
ROM Words: 60032
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: LQFP
Width: 7 mm
Moisture Sensitivity Level (MSL): 3
Speed: 40 rpm
Peripheral IC Type: MICROCONTROLLER
Maximum Supply Voltage: 5.5 V
RAM Bytes: 4096
External Data Bus Width: 0
Bit Size: 8
DAC Channels: NO
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP32,.35SQ,32
Length: 7 mm
PWM Channels: YES
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/5
CPU Family: HCS08
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