NXP Semiconductors - MC56F8323MFBE

MC56F8323MFBE by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number MC56F8323MFBE
Description DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
Datasheet MC56F8323MFBE Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 2.25 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.5 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Terminal Finish: TIN
No. of Terminals: 64
Terminal Position: QUAD
Format: FIXED POINT
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PQFP-G64
Maximum Clock Frequency: 120 MHz
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Package Code: LFQFP
Width: 10 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER
Maximum Supply Voltage: 2.75 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 0
Barrel Shifter: YES
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Internal Bus Architecture: MULTIPLE
Qualification: Not Qualified
Length: 10 mm
Additional Features: ALSO REQUIRES 3.3V SUPPLY
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
Temperature Grade: AUTOMOTIVE
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products