NXP Semiconductors - MC13156FB

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MC13156FB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC13156FB
Description CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Datasheet MC13156FB Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Telecom IC Type: CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Maximum Supply Current: 8 mA
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 32
Package Equivalence Code: QFP32,.35SQ,32
Terminal Position: QUAD
Package Style (Meter): FLATPACK, LOW PROFILE
Length: 7.025 mm
Technology: BIPOLAR
JESD-30 Code: S-PQFP-G32
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: LQFP
Width: 7.025 mm
Terminal Pitch: .8 mm
Moisture Sensitivity Level (MSL): 1
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