NXP Semiconductors - MC10XSD200FK

MC10XSD200FK by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number MC10XSD200FK
Description BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 23; Package Code: QCCN; Qualification: Not Qualified;
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Driver No. of Bits: 2
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Peripheral Drivers
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 23
Qualification: Not Qualified
Package Equivalence Code: LCC23(UNSPEC)
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER
Technology: BICMOS
Terminal Form: NO LEAD
Maximum Operating Temperature: 125 Cel
Peak Reflow Temperature (C): 260
Package Code: QCCN
Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 3.3/5,8/36
Moisture Sensitivity Level (MSL): 3
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products