NXP Semiconductors - GTL2000DGG,118

GTL2000DGG,118 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number GTL2000DGG,118
Description LOGIC CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet GTL2000DGG,118 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Packing Method: TR, 13 INCH
Sub-Category: Other Logic ICs
Surface Mount: YES
Logic IC Type: LOGIC CIRCUIT
Minimum Operating Temperature: -40 Cel
No. of Terminals: 48
Qualification: Not Qualified
Package Equivalence Code: TSSOP48,.3,20
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: MOS
JESD-30 Code: R-PDSO-G48
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): 260
Package Code: TSSOP
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2.5,3.3
Moisture Sensitivity Level (MSL): 1
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