NXP Semiconductors - BZV55-C3V3,115

BZV55-C3V3,115 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BZV55-C3V3,115
Description ZENER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Datasheet BZV55-C3V3,115 Datasheet
NAME DESCRIPTION
Package Body Material: GLASS
Maximum Time At Peak Reflow Temperature (s): 30
Working Test Current: 5 mA
Config: SINGLE
Diode Type: ZENER DIODE
Maximum Voltage Temperature Coefficient: 0 mV/Cel
Sub-Category: Voltage Reference Diodes
Surface Mount: YES
Terminal Finish: TIN
Maximum Reverse Current: 5 uA
No. of Terminals: 2
Terminal Position: END
Package Style (Meter): LONG FORM
Technology: ZENER
JESD-30 Code: O-LELF-R2
No. of Elements: 1
Package Shape: ROUND
Terminal Form: WRAP AROUND
Polarity: UNIDIRECTIONAL
Maximum Operating Temperature: 200 Cel
Case Connection: ISOLATED
Maximum Dynamic Impedance: 95 ohm
Moisture Sensitivity Level (MSL): 1
JESD-609 Code: e3
Minimum Operating Temperature: -65 Cel
Maximum Voltage Tolerance: 5 %
Diode Element Material: SILICON
Qualification: Not Qualified
Nominal Reference Voltage: 3.3 V
Maximum Power Dissipation: .4 W
Peak Reflow Temperature (C): 260
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