NXP Semiconductors - BR100/03LLD

BR100/03LLD by NXP Semiconductors

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	BR100/03LLD
Description	DIAC; Package Style (Meter): LONG FORM; Surface Mount: YES; Terminal Position: END; Configuration: SINGLE; Case Connection: ISOLATED;
Datasheet	BR100/03LLD Datasheet

BR100/03LLD Technical Details

NAME	DESCRIPTION
Package Body Material:	GLASS
Trigger Device Type:	DIAC
Maximum Breakdown Voltage:	36 V
Configuration:	SINGLE
Sub-Category:	DIACs
Surface Mount:	YES
No. of Terminals:	2
Qualification:	Not Qualified
Terminal Position:	END
Package Style (Meter):	LONG FORM
JESD-30 Code:	O-LELF-R2
Minimum Breakdown Voltage:	28 V
No. of Elements:	1
Package Shape:	ROUND
Terminal Form:	WRAP AROUND
Maximum Operating Temperature:	100 Cel
Case Connection:	ISOLATED

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