NXP Semiconductors - BB219

BB219 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BB219
Description VARIABLE CAPACITANCE DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Datasheet BB219 Datasheet
NAME DESCRIPTION
Package Body Material: GLASS
Reverse Test Voltage: 28 V
Config: SINGLE
Diode Type: VARIABLE CAPACITANCE DIODE
Frequency Band: VERY HIGH FREQUENCY
Surface Mount: YES
Maximum Reverse Current: .01 uA
Diode Element Material: SILICON
No. of Terminals: 2
Minimum Diode Capacitance Ratio: 12
Qualification: Not Qualified
Terminal Position: END
Package Style (Meter): LONG FORM
JESD-30 Code: O-LELF-R2
Minimum Breakdown Voltage: 30 V
No. of Elements: 1
Package Shape: ROUND
Terminal Form: WRAP AROUND
Additional Features: CAPACITANCE MATCHED TO 2.5% FOR ANY TWO DIODES
Maximum Operating Temperature: 100 Cel
Case Connection: ISOLATED
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