NXP Semiconductors - BAP70AM,135

BAP70AM,135 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BAP70AM,135
Description PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 6; Surface Mount: YES; Package Shape: RECTANGULAR;
Datasheet BAP70AM,135 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Forward Voltage (VF): 1.1 V
Config: 2 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode Type: PIN DIODE
Sub-Category: Other Diodes
Surface Mount: YES
Terminal Finish: TIN
Maximum Reverse Current: .1 uA
No. of Terminals: 6
Terminal Position: DUAL
Maximum Diode Capacitance: .25 pF
Package Style (Meter): SMALL OUTLINE
Technology: POSITIVE-INTRINSIC-NEGATIVE
JESD-30 Code: R-PDSO-G6
No. of Elements: 4
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 150 Cel
Maximum Diode Forward Resistance: 1.9 ohm
Moisture Sensitivity Level (MSL): 1
Nominal Minority Carrier Lifetime: 1.25 us
Reverse Test Voltage: 50 V
Maximum Repetitive Peak Reverse Voltage: 50 V
JESD-609 Code: e3
Minimum Operating Temperature: -65 Cel
Diode Element Material: SILICON
Qualification: Not Qualified
Maximum Power Dissipation: .3 W
Additional Features: LOW DISTORTION
Peak Reflow Temperature (C): 260
Application: ATTENUATOR
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