NXP Semiconductors - BAP64Q

BAP64Q by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BAP64Q
Description PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 5; Surface Mount: YES; Package Shape: RECTANGULAR;
Datasheet BAP64Q Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Config: COMPLEX
Diode Type: PIN DIODE
Frequency Band: S BAND
Surface Mount: YES
Terminal Finish: TIN
No. of Terminals: 5
Terminal Position: DUAL
Maximum Diode Capacitance: .35 pF
Package Style (Meter): SMALL OUTLINE
Technology: POSITIVE-INTRINSIC-NEGATIVE
JESD-30 Code: R-PDSO-G5
No. of Elements: 4
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 150 Cel
Maximum Diode Forward Resistance: 1.35 ohm
Moisture Sensitivity Level (MSL): 1
Nominal Minority Carrier Lifetime: 1.55 us
JESD-609 Code: e3
Minimum Operating Temperature: -65 Cel
Diode Element Material: SILICON
Qualification: Not Qualified
Maximum Power Dissipation: .125 W
Peak Reflow Temperature (C): 260
Application: ATTENUATOR
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