NXP Semiconductors - BAP50LX,315

BAP50LX,315 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BAP50LX,315
Description PIN DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Datasheet BAP50LX,315 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Diode Resistive Test Frequency: 100 MHz
Maximum Time At Peak Reflow Temperature (s): 30
Config: SINGLE
Diode Type: PIN DIODE
Frequency Band: S BAND
Diode Resistive Test Current: .5 mA
Sub-Category: PIN Diodes
Surface Mount: YES
Terminal Finish: Tin (Sn)
No. of Terminals: 2
Terminal Position: BOTTOM
Maximum Diode Capacitance: .55 pF
Package Style (Meter): CHIP CARRIER
Technology: POSITIVE-INTRINSIC-NEGATIVE
JESD-30 Code: R-PBCC-N2
Minimum Breakdown Voltage: 50 V
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 150 Cel
Maximum Diode Forward Resistance: 5 ohm
Moisture Sensitivity Level (MSL): 1
Nominal Minority Carrier Lifetime: 1 us
Reverse Test Voltage: 0 V
JESD-609 Code: e3
Minimum Operating Temperature: -65 Cel
Nominal Diode Capacitance: .4 pF
Diode Element Material: SILICON
Qualification: Not Qualified
Maximum Power Dissipation: .15 W
Peak Reflow Temperature (C): 260
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